Virtual Oscilloscope – Electromagnetic Analysis for Package Verification and Fast Analysis in Design Cycle

In the semiconductor integrated circuits (IC) industry, electronic design automation (EDA) tools have been effectively used for design and verification of functionality and electrical parameters such as power, noise, timing before the chip is sent for tape-out. On the other hand, at the system-level a major portion of the electrical verification work is routinely performed at the end of the design cycle by making prototypes. This results in time-to-market delays and/or cancelled projects resulting in loss of revenue and sub-optimal system design. The goal of this project was to enable design and verification tools at the package-PCB-system level.

Through the course of this project, key technologies were developed towards system-level electronic and electrical design and verification. The major work done can be classified as:

  • (a) Electromagnetic solver development: 2D, 2.5D, 3D electromagnetic solvers were developed.
  • (b) Automatic hybrid solvers: A machine learning-based approach was developed to automatically identify parts of the geometry to be handled by 2D and 3D.
  • (c) Parallel solvers: The 3D electromagnetic solver was parallelised for multi-core and many-core applications.

Publications:

  1. Govindan, K. Bharath, S. Venkataraman and D. Gope, “A State-Space-Based Method to Model Vccin Feedthrough Noise in Microprocessors With Fully Integrated Voltage Regulators,” in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 9, pp. 1391-1401, Sept. 2021, doi: 10.1109/TCPMT.2021.3098103.
  2. Sahoo and D. Gope, “NEXT & FEXT Prediction using Hybrid 2D-3D Solver for Fast Electromagnetic Analysis,” 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2020, pp. 1-3, doi: 10.1109/EDAPS50281.2020.9312892.
  3. Govindan, K. Bharath, S. Venkataraman and D. Gope, “A Large-Signal Method for Modeling Vccin feedthrough Noise in Microprocessors with Fully Integrated Voltage Regulators,” 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2020, pp. 1-3, doi: 10.1109/EDAPS50281.2020.9312913.
  4. Sahoo, D. Gope, N. Ambasana, D. Eesha and A. Chandrasekhar, “Hybrid 2D-3D Fast Electromagnetic Analysis aided by Pattern Recognition for Signal Integrity Analysis,” 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2019, pp. 1-3, doi: 10.1109/EPEPS47316.2019.193196.

Impact and significance: SimYog

The research results of this project inspired the incubation of a startup company named  SimYog Technology Pvt Ltd. The research done during the project, especially the development of fast 3D full-wave electromagnetic solvers and benchmarking the same with measurement data, helped take the project from TRL-3 to TRL-6 levels. Then, the technology was transferred to SimYog through FSID/IPTeL and formed the core of the solvers that is used at SimYog. Simyog’s customers include Texas Instruments, Microchip, STMicroelectronics, Infineon, Bosch, DENSO, Panasonic, and Mercedes-Benz. The company was awarded the KA government Elevate award in 2018 and NASSCOM Emerge-50 award in 2021.

SimYog provides an enterprise software tool called Compliance-Scope. It is the world’s first ‘virtual EMI/EMC laboratory’ for predicting radiated emissions (RE), conducted emissions (CE), radiated immunity (RI), and conducted immunity (CI) compliance tests. It enables design for EMC – predicting EMC issues in the early-design-stage of hardware, as well as diagnosis capability to reduce risk. Compliance-Scope is in production for use at semiconductor and systems companies worldwide.

Publications: https://www.simyog.com/publications

Patents granted (India):

IN551424: A LEARNING-BASED SURROGATE MODEL OF CONDUCTED NOISE FROM INTEGRATED CIRCUITS (ICS) UNDER DIFFERENT OPERATING CONDITIONS

IN581550: A SYSTEM FOR ANALYZING SYSTEM-LEVEL ELECTROMAGNETIC INTERFERENCE AND ELECTROMAGNETIC COMPATIBILITY

Awards:

  • IESA Technovation Award 2025–26 (Start-Up Winner) in the Semiconductor category at the IESA Vision Summit 2026
  • SEMCEI Industry award at APEMC INCEMIC 2023
  • 30 most promising Indian startups of 2022 as part of YourStory Tech30
  • Qualcomm Semiconductor Mentorship Program (SMP) 2022 cohort
  • NASSCOM Emerge 50 Award in the Enterprise category 2021

 

Faculty: Dipanjan Gope
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